Addition Cure Silicone Gel HN-6607 | No By-Products | Low Shrinkage
Product Overview for Electronic Silicone Gel:
HN-6607 utilizes an advanced addition-cure (Platinum catalyst)
system, releasing no low molecular weight by-products during curing
and exhibiting extremely low shrinkage. This makes it ideal for
precision electronic potting applications sensitive to volatiles or
requiring high dimensional accuracy.
Product Performance for Electronic Silicone Gel:
- Cure Type: Addition Cure (Platinum Catalyzed)
- Shrinkage: Very Low (typically <1%)
- Curing By-products: None
- Purity: High, suitable for sensitive components
- Hardness After Curing: 0–10 Shore A
Product Highlights for Electronic Silicone Gel:
- ✅ Clean Cure: No outgassing, protects sensitive components.
- ✅ Dimensionally Stable: Ultra-low shrinkage, minimal internal
stress.
- ✅ Environmentally Friendly: Odorless during cure.
- ✅ Excellent Overall Performance: Soft, insulating, and sealing.
Product Applications for Electronic Silicone Gel:
- MEMS sensor encapsulation
- Chip Scale Package (CSP) underfill
- Protection for high-frequency circuit boards
- Potting components with fine metal contacts
Operation Guide for Electronic Silicone Gel:
1. Avoid contact with substances containing N, P, S, Sn, Pb (e.g.,
certain rubbers, solder fluxes, cleaners) to prevent catalyst
poisoning.
2. Keep mixing/application tools clean, preferably dedicated.
3. Mix at 1:1 weight ratio and pot.
4. Cure at 120°C for 20-30 minutes.
Precautions for Electronic Silicone Gel:
- Strictly prevent catalyst poisoning. Perform compatibility tests
if unsure about other materials.
Packaging & Storage for Electronic Silicone Gel:
- Packaging: 50 kg per set (25 kg pail of A + 25 kg pail of B)
- Storage: Keep in a sealed container in a cool, dry place below
25°C. Do not store with different chemical types.
- Shelf Life: 6 months (below 25°C).
- Transportation: Classified as non-hazardous goods; can be
transported as general chemicals.
FAQ for Electronic Silicone Gel:
1. Q: What is catalyst poisoning? What is the consequence?
A: Certain impurities (containing N, P, S, Sn, Pb) can deactivate
the platinum catalyst, preventing the gel from curing permanently.
2. Q: What is the approximate volume shrinkage?
A: Very low, typically much less than 1%. Consult our technical
department for specific data.
3. Q: Can it be used with or over epoxy resin?
A: Not recommended over uncured epoxy. Even if cured, ensure no
amine, imidazole, or other catalyst residues remain on the epoxy
surface, as they may cause poisoning. Test or use a barrier.
4. Q: Is it sensitive to copper?
A: It may affect bare, untreated copper. Use coated (e.g., tinned,
nickel-plated) copper or conduct strict compatibility tests.
5. Q: Is the cured gel recyclable or biodegradable?
A: No, it is a thermoset material and cannot be melted or recycled.
It is difficult to degrade and should be disposed of as industrial
solid waste.
