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Heat Curing Silicone Epoxy Potting Compound Material For Encapsulation Connectors 2 Component Epoxt Potting Material Customization Acceptable

Shenzhen Hanast New Material co.,LTD
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    Buy cheap Heat Curing Silicone Epoxy Potting Compound Material For Encapsulation Connectors 2 Component Epoxt Potting Material Customization Acceptable from wholesalers
     
    Buy cheap Heat Curing Silicone Epoxy Potting Compound Material For Encapsulation Connectors 2 Component Epoxt Potting Material Customization Acceptable from wholesalers
    • Buy cheap Heat Curing Silicone Epoxy Potting Compound Material For Encapsulation Connectors 2 Component Epoxt Potting Material Customization Acceptable from wholesalers
    • Buy cheap Heat Curing Silicone Epoxy Potting Compound Material For Encapsulation Connectors 2 Component Epoxt Potting Material Customization Acceptable from wholesalers
    • Buy cheap Heat Curing Silicone Epoxy Potting Compound Material For Encapsulation Connectors 2 Component Epoxt Potting Material Customization Acceptable from wholesalers
    • Buy cheap Heat Curing Silicone Epoxy Potting Compound Material For Encapsulation Connectors 2 Component Epoxt Potting Material Customization Acceptable from wholesalers
    • Buy cheap Heat Curing Silicone Epoxy Potting Compound Material For Encapsulation Connectors 2 Component Epoxt Potting Material Customization Acceptable from wholesalers
    • Buy cheap Heat Curing Silicone Epoxy Potting Compound Material For Encapsulation Connectors 2 Component Epoxt Potting Material Customization Acceptable from wholesalers

    Heat Curing Silicone Epoxy Potting Compound Material For Encapsulation Connectors 2 Component Epoxt Potting Material Customization Acceptable

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    Brand Name : Hanast
    Model Number : HN-5508AB
    Certification : ROHS SGS
    Payment Terms : T/T
    Price : Negotiable
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    Heat Curing Silicone Epoxy Potting Compound Material For Encapsulation Connectors 2 Component Epoxt Potting Material Customization Acceptable

    Heat Curing Silicone Epoxy Potting Compound Material For Encapsulation Connectors 2 Component Epoxt Potting Material Customization Acceptable


    Product descriptions:

    HN-5508 epoxy resin at room temperature or low temperature, with low viscosity, long operation time, good fluidity, and easy penetration into the clearance of the product

    Product features:

    Low viscosity, long operation time, good fluidity, and easy penetration into the clearance of the product; no bubbles after curing, smooth surface, luster, high hardness; curing materials have good acid and alkali resistance, moisture-proof, moisture, and air aging; curing materials have excellent insulation

    Before curing

    builder

    Epoxy resin 5508

    Curing agent 5508

    pigment

    Black / White et al

    Ruburn / transparent surface

    A sticky epoxy resin water

    r liquid specific

    c gravity, g / cm3

    1.4-1.5

    1.05

    Viscosity of 25℃

    4,500—6,000cp s

    150—250cp storage

    e Period (25℃)

    Six months

    x months


    processabili


    mixing ratio

    A: B =5:1 (weight ratio)

    Available for a time of 25℃

    2-3H (100g mix)

    curing time

    25℃ / 6-8H surface stem, 12-16H fully cured or 60-80℃/1.5-2H

    After curing

    2 Tensile strength of kg/cm

    16-18

    2 Compressive strength of kg/cm

    18-22

    Resistance to the voltage of kv/mm

    20-22

    Surface resistance ofΩ-cm

    14

    1.2*10

    Volume resistance ofΩ-cm

    15

    1.1*10

    contraction percentage%

    0.35-0.55

    Water absorption rate was 25℃ * 24H

    <0.03%


    The hardness of SHORE A

    85-95

    distortion

    temperature ℃

    130-150

    low temperature resistant ℃

    -30

    Application:

    HN-5508 is widely used in transformers, resistors, filters, temperature sensors, temperature controllers

    Quality Heat Curing Silicone Epoxy Potting Compound Material For Encapsulation Connectors 2 Component Epoxt Potting Material Customization Acceptable for sale
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